• DocumentCode
    3506945
  • Title

    Reliability evaluation of GaN based light-emitting diodes under high-temperature stressing

  • Author

    Meijuan Fu ; Luqiao Yin ; Fei Weng ; Lianqiao Yang ; Jianhua Zhang

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Shanghai Univ., Shanghai, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1262
  • Lastpage
    1265
  • Abstract
    The reliability evaluation of Light Emitting Diodes (LED) is analyzed by lifetime test, which is usually derived from the accelerated test. In order to find the problem why the LED cannot reach the claimed lifetime, the reliability issue of the LED is investigated by the accelerated temperature tests. One of the accelerated test environment temperature is 55 °C and the environment is an oven, while the other is the room temperature of 23 °C. All the HP-LED samples are driven by the same current 450 mA. Some of the samples in the oven showed the phenomenon of current leakage since 200 hours aging, but the samples in the room temperature did not. In addition, luminous flux of the samples in the oven decreased faster after the same aging period. The HP-LED with current leakage shows faster luminous flux descending. In a word, the degradation behaviors of GaN based light-emitting diodes under high-temperature stressing is investigated.
  • Keywords
    III-V semiconductors; gallium compounds; light emitting diodes; reliability; wide band gap semiconductors; GaN; HP-LED samples; LED reliability evaluation; accelerated temperature tests; current 450 mA; high-temperature stressing; light-emitting diode reliability evaluation; temperature 23 degC; temperature 293 K to 298 K; temperature 55 degC; time 200 hour; Integrated optics; Life estimation; Light emitting diodes; Optical devices; Optical switches; Packaging; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474835
  • Filename
    6474835