Title :
Leakage failure analysis of nickel-copper gas-proof material used in traveling-wave tube
Author :
Chengshi Zhang ; Shengxiang Bao ; Xiaowen Zhang ; Zuwen Wang ; Peng Li ; Long Gui
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
With the specific characteristic of well ambient temperature mechanical properties, high temperature strength and corrosion resistance, excellent wear-resistance, easy processing, non-magnetic, the nickel-copper alloys were widely applied on the radio frequency (RF) system of the traveling-wave tube (TWT) [1]. The outstanding performance of the TWT is closely related to its gas-proof material. But abnormal sample of poor vacuum tightness and discoloration (turning black) happened in the process of working. Compared with different samples (normal and abnormal ones), both were observed including microstructure and composition analysis combining with electron microanalysis by scanning electron microscope (SEM) and energy dispersive spectrometer (EDS). The results showed that manganese segregation at grain boundary in the process of burning hydrogen, oxidation reaction with free oxygen on the surface, and the manganese oxide made the surface of nickel-copper alloy black and weaken the cohesive power inside the grain boundary, which the intergranular fracture and poor gas tightness of the nickel-copper alloys were aroused by them.
Keywords :
brittle fracture; failure analysis; grain boundaries; leakage currents; manganese compounds; nickel compounds; travelling wave tubes; EDS; RF system; SEM; TWT; ambient temperature mechanical property; burning hydrogen; cohesive power; composition analysis; corrosion resistance; discoloration; electron microanalysis; energy dispersive spectrometer; gas tightness; grain boundary; high temperature strength; intergranular fracture; leakage failure analysis; manganese oxide; manganese segregation; microstructure analysis; nickel-copper alloy black; nickel-copper alloys; nickel-copper gas-proof material; oxidation reaction; poor vacuum tightness; radio frequency system; scanning electron microscope; traveling-wave tube; turning black; wear-resistance; Abstracts; Impurities; Manganese; Materials; Microscopy; Microstructure;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474839