• DocumentCode
    3507056
  • Title

    Leakage failure analysis of nickel-copper gas-proof material used in traveling-wave tube

  • Author

    Chengshi Zhang ; Shengxiang Bao ; Xiaowen Zhang ; Zuwen Wang ; Peng Li ; Long Gui

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1280
  • Lastpage
    1283
  • Abstract
    With the specific characteristic of well ambient temperature mechanical properties, high temperature strength and corrosion resistance, excellent wear-resistance, easy processing, non-magnetic, the nickel-copper alloys were widely applied on the radio frequency (RF) system of the traveling-wave tube (TWT) [1]. The outstanding performance of the TWT is closely related to its gas-proof material. But abnormal sample of poor vacuum tightness and discoloration (turning black) happened in the process of working. Compared with different samples (normal and abnormal ones), both were observed including microstructure and composition analysis combining with electron microanalysis by scanning electron microscope (SEM) and energy dispersive spectrometer (EDS). The results showed that manganese segregation at grain boundary in the process of burning hydrogen, oxidation reaction with free oxygen on the surface, and the manganese oxide made the surface of nickel-copper alloy black and weaken the cohesive power inside the grain boundary, which the intergranular fracture and poor gas tightness of the nickel-copper alloys were aroused by them.
  • Keywords
    brittle fracture; failure analysis; grain boundaries; leakage currents; manganese compounds; nickel compounds; travelling wave tubes; EDS; RF system; SEM; TWT; ambient temperature mechanical property; burning hydrogen; cohesive power; composition analysis; corrosion resistance; discoloration; electron microanalysis; energy dispersive spectrometer; gas tightness; grain boundary; high temperature strength; intergranular fracture; leakage failure analysis; manganese oxide; manganese segregation; microstructure analysis; nickel-copper alloy black; nickel-copper alloys; nickel-copper gas-proof material; oxidation reaction; poor vacuum tightness; radio frequency system; scanning electron microscope; traveling-wave tube; turning black; wear-resistance; Abstracts; Impurities; Manganese; Materials; Microscopy; Microstructure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474839
  • Filename
    6474839