Title :
Research on BGA solder joint two-dimensional quality information extraction
Author :
Huihuang Zhao ; Yaonan Wang ; Yaqi Sun
Author_Institution :
Dept. of Comput. Sci., Hengyang Normal Univ., Hengyang, China
Abstract :
A extraction approach is proposed based on an image processing in order to improve the accuracy of 2D quality information extraction for surface mount technology (SMT) BGA(Ball Grid Array) solder joint of chip components. First, some appropriate image processing algorithms are utilized to eliminate the noise in the solder joint image. And a binaryzation image is obtained after character. Then the BGA Solder Joint 2D quality information extraction system is developed based on Visual C++, and the 2D quality information of solder joint circumference, area, void area, and diameter, are obtained. The experimental results have illustrated that the system can accomplish a good extraction result.
Keywords :
C++ language; ball grid arrays; electronic engineering computing; image processing; solders; surface mount technology; BGA solder joint 2D quality information extraction system; BGA solder joint two-dimensional quality information extraction; SMT ball grid array solder joint; Visual C++; binarization image; chip components; extraction approach; image processing algorithms; solder joint image; surface mount technology BGA; Calibration; Joints; Lead;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474840
