Title :
The Study of infrared radiation thermal imaging technology for temperature testing
Author :
Fang fang Song ; Xiaoqi He ; Ping Lai ; Ren Wang
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
Abstract :
Along with the infrared technical rapid development, infrared radiation (IR) infrared thermal image technology is widely applied in nondestructive testing. In this paper, the theoretical basis of IR thermal imaging technology and the method of emissivity and background correction are introduced. The thermal characteristic of one kind of packaging device was studied using infrared thermal imaging technology and FEM (Finite element method), for example, microwave module. Through the comparison and analysis of the infrared images of one type of microwave module at working condition, the junction temperature of electronic chips is obtained.
Keywords :
emissivity; finite element analysis; infrared imaging; integrated circuit packaging; integrated circuit testing; nondestructive testing; radiation hardening (electronics); semiconductor device testing; thermal management (packaging); FEM; IR infrared thermal image technology; electronic chip; emissivity; finite element method; infrared radiation thermal imaging technology; infrared technical rapid development; junction temperature; microwave module; nondestructive testing; packaging device; temperature testing; thermal characteristic; Electromagnetic heating; Finite element methods; Microwave imaging; Microwave theory and techniques; Temperature measurement; Thermal analysis;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474853
