• DocumentCode
    3507435
  • Title

    The Study of infrared radiation thermal imaging technology for temperature testing

  • Author

    Fang fang Song ; Xiaoqi He ; Ping Lai ; Ren Wang

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1336
  • Lastpage
    1339
  • Abstract
    Along with the infrared technical rapid development, infrared radiation (IR) infrared thermal image technology is widely applied in nondestructive testing. In this paper, the theoretical basis of IR thermal imaging technology and the method of emissivity and background correction are introduced. The thermal characteristic of one kind of packaging device was studied using infrared thermal imaging technology and FEM (Finite element method), for example, microwave module. Through the comparison and analysis of the infrared images of one type of microwave module at working condition, the junction temperature of electronic chips is obtained.
  • Keywords
    emissivity; finite element analysis; infrared imaging; integrated circuit packaging; integrated circuit testing; nondestructive testing; radiation hardening (electronics); semiconductor device testing; thermal management (packaging); FEM; IR infrared thermal image technology; electronic chip; emissivity; finite element method; infrared radiation thermal imaging technology; infrared technical rapid development; junction temperature; microwave module; nondestructive testing; packaging device; temperature testing; thermal characteristic; Electromagnetic heating; Finite element methods; Microwave imaging; Microwave theory and techniques; Temperature measurement; Thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474853
  • Filename
    6474853