• DocumentCode
    3507517
  • Title

    The reliability evaluation of the bonding wire in the DC/DC power under the environment of humidity

  • Author

    Zhang XiaoWen ; He Xiaoqi

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., CEPREI, Guangzhou, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1357
  • Lastpage
    1359
  • Abstract
    Aluminum is an active metal; it can form aluminum oxide (Al2O3) when left exposed to air. Aluminum oxide can dissolve in either acid or alkaline solutions, and lead to Corrosion failures on bonding-pad or internal line. In order to evaluate the reliability of bonding wires inside the DC/DC power, the reliability test structure of bonding wire in the DC/DC power has been designed, which has been made by connecting several bonding wire in series, all these bonding wires are bonded on the surface of the Aluminum slice, and all the Aluminum slice is mounted on the surface of ceramic substrate. Two ampere electrical current has been put into the test structure chain to simulate the bonding wire working condition under the operation environment, so the reliability of the DC/DC power under the humidity condition can be assessed. The resistor degradation process of the bonding wire have been conducted through the accelerating of temperature and humidity under the 85 °C/85%RH environment. After 2185 hours accelerating lifetime experiment, the reliability of the DC/DC power under the humidity condition has been evaluated. The result is that if the process is well controlled, the bonding wires are robust to the humidity environment, no failure take place even if there is 5000PPM water vapor existing in the package.
  • Keywords
    DC-DC power convertors; aluminium; bonding processes; corrosion; humidity; reliability; temperature; wires (electric); DC/DC power; acid solution; alkaline solution; aluminum oxide; aluminum slice; ampere electrical current; bonding wire; bonding-pad; ceramic substrate; corrosion failures; humidity condition; humidity environment; internal line; lifetime experiment; operation environment; reliability evaluation; reliability test structure; resistor degradation process; temperature; test structure chain; water vapor; Aluminum; Bonding; Corrosion; Humidity; Reliability; Resistors; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474858
  • Filename
    6474858