Analysis and optimal SAW ladder filter design including bonding wire and package impedance

Author

Mineyoshi, S. ; Kawachi, O. ; Ueda, M. ; Fujiwara, Y. ; Furusato, H. ; Ikata, O.

Author_Institution

Fujitsu Labs. Ltd., Kawasaki, Japan

Volume

1

fYear

1997

fDate

5-8 Oct 1997

Firstpage

175

Abstract

This paper describes analysis and optimal design of SAW ladder filter, which includes effect of bonding wire and package impedance. Attenuation performance of SAW filter is influenced by not only their design conditions but also bonding wire effect and package design structure. To confirm their effect, theoretical and experimental analysis were studied, and it was found that electrical resonance generated by SAW element capacitance including capacitance of electrode fingers and stray capacitance, bonding wire and package inductance influence an attenuation characteristics. By using their characteristics effectively, we propose new improvement method of stop-band rejection

Keywords

electric impedance; ladder filters; lead bonding; packaging; surface acoustic wave resonator filters; SAW ladder filter; attenuation; bonding wire; capacitance; electrical resonance; electrode fingers; optimal design; package impedance; stop-band rejection; stray capacitance; Attenuation; Bonding; Capacitance; Character generation; Impedance; Packaging; Resonance; SAW filters; Surface acoustic waves; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE

Conference_Location

Toronto, Ont.

ISSN

1051-0117

Print_ISBN

0-7803-4153-8

Type

conf

DOI

10.1109/ULTSYM.1997.663004

Filename

663004