• DocumentCode
    3507565
  • Title

    The dielectric and mechanical characteristics of SiO2 filled epoxy composites

  • Author

    Kim, Kyung-Hwan ; Son, In-Hwan ; Lee, Deok-Jin ; Kim, Myung-Ho ; Jang, Kyung-Uk ; Kim, Jae-Hwan

  • Author_Institution
    Kyungwon Univ., Kyunggi-do, South Korea
  • Volume
    2
  • fYear
    1997
  • fDate
    25 -30 May 1997
  • Firstpage
    896
  • Abstract
    In this study, investigations were carried out on the dielectric and mechanical characteristics dependent on frequency and temperature for the composite material of epoxy filled with SiO2. As a result, the dielectric constants increase monotonously as the filler content increases, but the loss factor shows hardly any change. Also the mechanical strength relation is constant, while the magnitudes of shearing modulus and the mechanical hardness increase gradually as filler content increases
  • Keywords
    composite insulating materials; dielectric losses; elastic moduli; epoxy insulation; filled polymers; hardness; mechanical strength; permittivity; shear modulus; silicon compounds; SiO2; SiO2 filled epoxy composites; dielectric characteristics; dielectric constants; filler content; frequency dependence; loss factor; mechanical characteristics; mechanical hardness; mechanical strength; shearing modulus; temperature dependence; Dielectric devices; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Dielectrics and electrical insulation; Epoxy resins; Frequency; Loss measurement; Mechanical factors; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-2651-2
  • Type

    conf

  • DOI
    10.1109/ICPADM.1997.616581
  • Filename
    616581
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3507565