Title :
A study of ultrasonic bonding flip chip process and its reliability for low temperature interconnection
Author :
Yo-Han Song ; Sang-woon Seo ; Gu-Sung Kim
Author_Institution :
Kangnam Univ., Yongin, South Korea
Abstract :
The purpose of studying is to confirm the reliability criteria of ultrasonic bonding with different chip size. To ensure this purpose, three kinds of specimens are prepared for compared evaluation, and bonding condition is secured by reliability assessment. For testing, chips are created with 5 mm × 5 mm, 10mm × 10mm, and 15mm × 15mm. The bond interconnections between chip and substrate are designed more than fifteen points with different daisy chain. Substrates called PCBs also prepared to fit each chip. The ultrasonic bonding process is progressed to use the anisotropic conductive films (ACF). For comparing the bonding process, all specimens also progressed using thermo-compression bonding.
Keywords :
flip-chip devices; integrated circuit interconnections; integrated circuit reliability; low-power electronics; printed circuits; tape automated bonding; ultrasonic bonding; ACF; PCB; anisotropic conductive films; bond interconnections; bonding condition; chip size; low temperature interconnection; reliability assessment; reliability criteria; thermo-compression bonding; ultrasonic bonding flip chip process; ultrasonic bonding process; Abstracts; Bonding; Educational institutions; Electronic mail; Heating; Light emitting diodes; Reliability;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474865
