Title :
Impact of Sn3.0Ag0.5Cu solder powder size on the reliability of solder joints in high density led packages
Author :
Xinxin Wang ; Limin Ma ; Ya Qi ; Jianping Liu ; Fu Guo ; Li Liu
Author_Institution :
Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
Improving the reliability of solder joints is an urgent issue to guarantee the quality of surface assembly products. The size of components and pitches on the circuit board differs from each other which leads to the size of solder joints variation one by one. In this study, the size effect of solder powder on Sn-3.0Ag-0.5Cu solder joints in high density LED display packaging was investigated. The microstructure and shear stress of the solder joints were observed as-reflowed and after different thermal cycling period conditions. The study suggested that the type 3 solder joint had good reliability and mechanical property than others. So the type 3 Sn-3.0Ag-0.5Cu solder powder was recommended the best to package this high density LED display.
Keywords :
LED displays; copper alloys; reliability; silver alloys; solders; surface mount technology; tin alloys; SnAgCu; circuit board; high density LED display packaging; mechanical property; microstructure; shear stress; solder joint reliability; solder powder size; surface assembly products; thermal cycling period conditions; Joints; Light emitting diodes; Microstructure; Powders; Reliability; Soldering; Stress;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474871
