Title :
Development of a new die-attach process and related bonding tool for multi-chip LED module
Author :
Chunjin Hang ; Hong Wang ; Jingming Fei ; Chunqing Wang
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
Abstract :
A new die-attach process was presented for the multi-chip LED module, and the related bonding tool for the LED module was also designed. With the new bonding process and the novel bonding tool, 21 LED chips have been attached onto a single substrate within one bonding process. The investigation of bonding chips´ appearance and thickness of interface layer were carried out to evaluate the die-attach performance. The die-attach process has been optimized by studying the effects of bonding force on the die-attach performance. The results showed this method can provide a high die-attach precision as well as the chip attachment consistency.
Keywords :
light emitting diodes; light sources; microassembling; LED lighting source; bonding process; chip attachment consistency; die-attach process; high die-attach precision; multichip LED module; single substrate; Light emitting diodes; Lighting; Reliability; Substrates; Thermal resistance; Transient analysis;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474874
