Research on eutectic bonding processes and interfacial damage features in high power LED package

Metal bonding is the most promising die-attach process in high power LED package, which has lower thermal resistance and higher device reliability in comparison with the traditional insulation paste or silver paste die-attach processes. In this project, the eutectic bonding technology, flux-eutectic bonding technology and solder-bonding technology were studied, and the interfacial microstructure was observed and the failure features were revealed and analyzed. This study provided some basic date and a theoretical basis for the die-bonding processes and especially gives a direction for the LED packaging industry.