DocumentCode
3507946
Title
Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Design-to-Manufacturing Transfer Cycle. Proceedings 1988 (IEEE Cat. No.88CH2648-4)
fYear
1988
fDate
10-12 Oct. 1988
Firstpage
1
Abstract
Presents the front cover of the proceedings.
Keywords
electronic equipment manufacture; inspection; packaging; printed circuits; soldering; bonding; inspection; integrated-circuit packaging; laser machining; manufacturing automation; manufacturing research; manufacturing systems; metallurgy; packaging design; plastics; printed wiring board assembly; process technology; sealing techniques; semiconductor fabrication; soldering; surface mount technology; tape automated bonding; thermocompression joining;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location
Lake Buena Vista, FL, USA
Type
conf
DOI
10.1109/EMTS.1988.16135
Filename
16135
Link To Document