DocumentCode :
3507952
Title :
Phosphor concentration in silicone and its effect on the mechanical and interfacial properties of phosphor-filled silicone
Author :
Xing Chen ; Simin Wang ; Xiaogang Liu ; Sheng Liu
Author_Institution :
State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1447
Lastpage :
1450
Abstract :
The phenomenon that phosphor particles tend to settle in silicone is widely known. Recent researchers have discussed the effects of phosphor concentration on luminous efficacy of LED packaging. But to produce reliable products, mechanical and interfacial considerations are also essential. In this paper, the mechanical behaviors and interfacial strength of silicone with different levels of phosphor concentration are studied. In our experiments, four groups of silicone samples with different levels of phosphor concentration are prepared and are subjected to the uniaxial tensile loads. The results of tensile tests indicate that, for the same level of phosphor addition, higher phosphor concentration will result in lower tensile strength of the phosphor-filled silicone. SEM cross-section images show that the phosphor particles concentrate in the bottom area of the silicone layer. The fractograph of the material indicates that the crack initiates among the bottom area where phosphor particles settle. Interfacial tests of phosphor-filled silicone and GaN substrate are also conducted. The results demonstrate that phosphor concentration has negative effect on interfacial strength of materials. Therefore, for LED package, uniformly distributed phosphor in silicone is extremely demanded for mechanical and interfacial considerations.
Keywords :
electronics packaging; light emitting diodes; mechanical properties; phosphors; reliability; scanning electron microscopy; silicones; GaN; LED packaging; SEM cross-section images; crack; light emitting diodes; phosphor concentration; phosphor particles; phosphor-filled silicone interfacial properties; phosphor-filled silicone mechanical properties; reliable products; silicone interfacial strength; silicone layer; silicone mechanical behaviors; uniaxial tensile loads; Gallium nitride; Light emitting diodes; Materials; Mechanical factors; Packaging; Phosphors; Shearing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474879
Filename :
6474879
Link To Document :
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