• DocumentCode
    3507952
  • Title

    Phosphor concentration in silicone and its effect on the mechanical and interfacial properties of phosphor-filled silicone

  • Author

    Xing Chen ; Simin Wang ; Xiaogang Liu ; Sheng Liu

  • Author_Institution
    State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1447
  • Lastpage
    1450
  • Abstract
    The phenomenon that phosphor particles tend to settle in silicone is widely known. Recent researchers have discussed the effects of phosphor concentration on luminous efficacy of LED packaging. But to produce reliable products, mechanical and interfacial considerations are also essential. In this paper, the mechanical behaviors and interfacial strength of silicone with different levels of phosphor concentration are studied. In our experiments, four groups of silicone samples with different levels of phosphor concentration are prepared and are subjected to the uniaxial tensile loads. The results of tensile tests indicate that, for the same level of phosphor addition, higher phosphor concentration will result in lower tensile strength of the phosphor-filled silicone. SEM cross-section images show that the phosphor particles concentrate in the bottom area of the silicone layer. The fractograph of the material indicates that the crack initiates among the bottom area where phosphor particles settle. Interfacial tests of phosphor-filled silicone and GaN substrate are also conducted. The results demonstrate that phosphor concentration has negative effect on interfacial strength of materials. Therefore, for LED package, uniformly distributed phosphor in silicone is extremely demanded for mechanical and interfacial considerations.
  • Keywords
    electronics packaging; light emitting diodes; mechanical properties; phosphors; reliability; scanning electron microscopy; silicones; GaN; LED packaging; SEM cross-section images; crack; light emitting diodes; phosphor concentration; phosphor particles; phosphor-filled silicone interfacial properties; phosphor-filled silicone mechanical properties; reliable products; silicone interfacial strength; silicone layer; silicone mechanical behaviors; uniaxial tensile loads; Gallium nitride; Light emitting diodes; Materials; Mechanical factors; Packaging; Phosphors; Shearing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474879
  • Filename
    6474879