• DocumentCode
    3508015
  • Title

    Acoustic plate mode devices as liquid phase sensors

  • Author

    Ricco, A.J. ; Martin, S.J. ; Frye, G.C. ; Niemczyk, T.M.

  • Author_Institution
    Sandia Nat. Lab., Albuquerque, NM, USA
  • fYear
    1988
  • fDate
    6-9 June 1988
  • Firstpage
    23
  • Lastpage
    26
  • Abstract
    Acoustic plate mode devices (APMs) which show considerable promise as sensors of liquid properties and solution species, and as probes of the solid-liquid interface are described. Their sensitivity to a variety of parameters including viscosity, dielectric coefficient, ionic conductivity, and changes in surface mass and mechanical properties allow a variety of sensors to be constructed. At the same time, the relative magnitude of each of these effects must be considered at all times to properly interpret experimental results. The experimentally determined mass sensitivity of the 158-MHz APM in 0.19 mm thick ST-quartz, 44 cm/sup 2//g, is about one-third of the 97 MHz SAW mass sensitivity, but nevertheless allows accurate measurement of fractional monolayer mass changes at the solid/solution interface.<>
  • Keywords
    acoustic transducers; detectors; dielectric measurement; electrical conductivity measurement; electrical conductivity of electrolytic liquids; electrical conductivity of liquids; interface phenomena; mechanical variables measurement; monolayers; surface phenomena; viscosity measurement; 0.19 mm; 158 MHz; ST-quartz; acoustic plate mode device; dielectric coefficient; fractional monolayer mass changes; ionic conductivity; liquid phase sensors; liquid properties; mechanical properties; solid-liquid interface; solid/solution interface; solution species; surface mass; viscosity; Acoustic devices; Acoustic sensors; Conductivity; Dielectrics; Mechanical factors; Mechanical sensors; Probes; Sensor phenomena and characterization; Surface acoustic waves; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
  • Conference_Location
    Hilton Head Island, SC, USA
  • Type

    conf

  • DOI
    10.1109/SOLSEN.1988.26424
  • Filename
    26424