DocumentCode :
3508042
Title :
Fabrication of YAG glass ceramic and its application for light emitting diodes
Author :
Liang Yang ; Mingxiang Chen ; Shan Yu ; Zhicheng Lv ; Sheng Liu
Author_Institution :
State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci & Tech, Wuhan, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1463
Lastpage :
1466
Abstract :
In this paper, we present our recent research on phosphor glass ceramic technology, consisting of a ceramic plate of Ce (III) doped yttrium aluminum garnet (YAG:Ce) YAG glass ceramic. The glass ceramic is fabricated through high temperature solid state reaction method, and is detected to confirm crystal phase by SEM and XRF. The white light is successfully observed by packaging the glass ceramic slice to the blue LED chip. The ceramic packaged LED sample shows relatively lower CCT than the conventional phosphor dispensing LED sample. Controllable optical and geometrical properties of the YAG glass ceramic plate will bring about distinctive improvement in manufacturing of identical CCTs for high power white LEDs. The combination of phosphor ceramic slice with blue LED chip of a specific wavelength, if measured before the final assembly, enables targeted production of specific CCT white LEDs. The phosphor glass ceramic technology can be utilized for the combination with the thin flip chip LED technology, which permits a direct bonding of the ceramic slice to the light source surface of the LED. It is expected that this glass-ceramic is a promising candidate.
Keywords :
bonding processes; flip-chip devices; fluorescence; glass ceramics; high-temperature effects; light emitting diodes; optical properties; phosphors; scanning electron microscopy; semiconductor device packaging; semiconductor doping; ytterbium compounds; CCT; SEM; XRF; YAG glass ceramic fabrication; YAG:Ce; blue LED chip; ceramic packaged LED sample; ceramic plate; cerium doped yttrium aluminum garnet; controllable optical property; conventional phosphor dispensing LED sample; crystal phase; direct bonding; flip chip LED technology; geometrical property; glass ceramic slice packaging; high temperature solid state reaction method; light emitting diodes; light source surface; phosphor ceramic slice; phosphor glass ceramic technology; targeted production; white light; Ceramics; Fabrication; Gallium nitride; Glass; Light emitting diodes; Luminescence; Phosphors; LED; Phosphor glass ceramic; YAG;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474883
Filename :
6474883
Link To Document :
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