Title :
ISP module for stereoscopic 3D on a multi-core VLIW architecture
Author :
Velciov, Ivan ; Scott, John
Author_Institution :
Univ. “Politeh.”, Timisoara, Romania
Abstract :
In this paper a novel approach for a stereoscopic 3D module will be presented. The 3D module incorporates two inter-changeable camera sensors and a multi core VLIW System on Chip (SoC). The SoC is a multi-core DSP which incorporates ISP functionality and stereoscopic 3D processing on a single device.
Keywords :
image sensors; stereo image processing; system-on-chip; ISP module; interchangeable camera sensors; multicore VLIW system on chip; single device; stereoscopic 3D processing; Frequency measurement; High definition video; Image resolution; Presses; Retina; Software; Software measurement;
Conference_Titel :
Informatics, Electronics & Vision (ICIEV), 2012 International Conference on
Conference_Location :
Dhaka
Print_ISBN :
978-1-4673-1153-3
DOI :
10.1109/ICIEV.2012.6317359
