Analysis on the failure modes and mechanisms of LED packaging

Author

Liu Xin ; Fang Wenxiao

Author_Institution

Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., CEPREI, Guangzhou, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1500

Lastpage

1502

Abstract

In- and out-doors LED is a new device with excellent performance in power-saving, lighting efficiency, reaction time. Currently, it is widely used in communication, display, illumination. Reliability is a key point to promote its application. The most important reliability issue in LED modules is about packaging which includes refrigeration, bonding wire, the aging of organic material, good packaging design et al. In this paper, the failure modes and failure mechanisms of LED are reviewed, and some failure analysis cases are presented.

Keywords

ageing; failure analysis; lead bonding; light emitting diodes; lighting; organic semiconductors; semiconductor device packaging; semiconductor device reliability; LED module; LED packaging; bonding wire; failure analysis; failure mechanism; failure mode; in-doors LED; lighting efficiency; organic material; out-doors LED; packaging design; power saving; reaction time; refrigeration; reliability; Bonding; Compounds; Light emitting diodes; Materials; Packaging; Reliability; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474891

Filename

6474891