Title :
The simulation analysis of LED luminaires for indoor lighting
Author :
Wanchun Tian ; Daoguo Yang ; Miao Cai ; Zhen Zhang ; Ming Gong ; Yu Yang
Author_Institution :
Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
In this paper, some models of LED luminaires with drive power supply were established by Pro/Engineer. The temperature distribution of these models was obtained by ANSYS Workbench. And the influences of the location of drive power supply and surface areas of heat sinks were discussed. When drive power supply was located in different groove, the temperature of drive power supply was gradually reduced from 73.5 °C to 66.9 °C, and the chip temperature was mainly stabilized in 70 °C. And then increasing the surface areas of heat sinks, the highest temperature of LED luminaires gradually dropped 16.2 °C and 9.7 °C. At last, the simulation results were validated by a comparison with the test results. It is indicate that the temperature distribution from the finite element modeling matches reasonably well with the test results. Utilizing the advantages of these models, the heat dissipation of LED luminaires can be improved in some extent. This analysis has certain reference value to improve the reliability of LED luminaires products.
Keywords :
finite element analysis; light emitting diodes; lighting; reliability; ANSYS workbench; LED luminaire simulation analysis; LED luminaires product reliability; drive power supply; finite element modeling; heat sinks; indoor lighting; surface areas; temperature 16.2 degC; temperature 73.5 degC to 66.9 degC; temperature 9.7 degC; temperature distribution; Abstracts; Drives; Heat sinks; Heating; Junctions; Lead; Light emitting diodes;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474892
