• DocumentCode
    3508414
  • Title

    A monolithic silicon accelerometer with integral air damping and overrange protection

  • Author

    Barth, P.W. ; Pourahmadi, F. ; Mayer, R. ; Poydock, J. ; Petersen, K.

  • Author_Institution
    NovaSensor, Fremont, CA, USA
  • fYear
    1988
  • fDate
    6-9 June 1988
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    Novel piezoresistance silicon accelerometers for full-scale accelerations on the order of 0.5 G-100 G have been designed, fabricated, and tested. These, dual-beam cantilever devices incorporate silicon structures introduced at the wafer level for air damping and bidirectional overrange protection, resulting in a silicon/glass chip approximately 3.4 mm square and 1.5 mm thick, suitable for packaging in many configurations and for use in many applications. Critical damping and overdamping have been demonstrated with roll-off frequencies 500 Hz and above, and shock survival above 1000 G in all axes has been achieved. Cross-axis sensitivity is less than 2% for any axis. Device design was accomplished using finite-element modeling (FEM) to assess sensitivity, temperature coefficients, resonance modes, cross-axis sensitivity, and overrange characteristics. Analytical modeling was used to ´benchmark´ the FEM predictions for simplest cases, and experimental results are in good agreement with FEM.<>
  • Keywords
    accelerometers; elemental semiconductors; finite element analysis; monolithic integrated circuits; piezoelectric transducers; silicon; 1.5 mm; 3.4 mm; 500 Hz; air damping; bidirectional overrange protection; cross-axis sensitivity; dual-beam cantilever devices; finite-element modeling; overrange characteristics; piezoresistive Si accelerometer; resonance modes; temperature coefficients; Accelerometers; Damping; Glass; Life estimation; Packaging; Piezoresistance; Protection; Silicon; Testing; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
  • Conference_Location
    Hilton Head Island, SC, USA
  • Type

    conf

  • DOI
    10.1109/SOLSEN.1988.26427
  • Filename
    26427