DocumentCode :
3508463
Title :
Experimental and numerical investigations on the performance and reliability of CNT fins for micro-cooler
Author :
Yan Zhang ; Hui-feng Lv ; Jing-yu Fan ; Di Jiang ; Liu, Jiangchuan
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1573
Lastpage :
1577
Abstract :
The current development of electronic products towards miniaturization and multifunction is leading to an increase in the power density of chip and IC. The high power consumption and corresponding heat dissipation are two of the most serious limitations for high performance electronics. The combination of the carbon nanotube (CNT) with outstanding thermal properties with an air jet cooling provides a promising option for the heat dissipation of high-powered components and devices. In the present paper, the CNTs are utilized to manufacture the pin-fins for the micro-cooler, and the performance and evaluation of this CNT-based micro-pin-fin cooler are investigated both experimentally and numerically. The effects of various parameters, such as the jet velocity and height, the fin size and shape, and so on, on the flow field and temperature distribution characteristics are comprehensively considered and analyzed. The obtained results indicate that the CNT-fins are of quite good strength and thermal performance in the jet impingement cooling environment.
Keywords :
carbon nanotubes; cooling; jets; microfluidics; semiconductor device reliability; temperature distribution; thermal management (packaging); CNT-based micropin-fin cooler; IC; air jet cooling; carbon nanotube; chip; electronic product miniaturization; electronic product multifunction; flow field; heat dissipation; high performance electronics; high-powered component; high-powered device; jet impingement cooling environment; jet velocity; pin-fins manufacture; power consumption; power density; reliability; temperature distribution characteristics; thermal performance; thermal properties; Abstracts; Carbon nanotubes; Geometry; Heating; Reliability; Resistance; Surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474907
Filename :
6474907
Link To Document :
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