Title :
Si IGBT phase-leg module packaging and cooling design for operation at 200 °C in hybrid electrical vehicle applications
Author :
Xu, Zhuxian ; Jiang, Dong ; Li, Ming ; Ning, Puqi ; Wang, Fred ; Liang, Zhenxian
Author_Institution :
Center for Ultra-wide-area Resilient, Univ. of Tennessee, Knoxville, TN, USA
Abstract :
A Si IGBT phase-leg module is designed and fabricated for operating at 200 °C in hybrid electrical vehicle (HEV) applications. First, a phase-leg package design is given including die selection, material selection, and layout design. Then the static and switching characterization of the fabricated module is conducted at various temperatures. The losses for a kW phase-leg in three-phase motor drive are calculated based on the characterization. Thermal performance of the proposed package and cooling is then evaluated with both (finite element analysis) FEA simulation and experiments. The simulation and experimental results agree well, which show that the proposed packaging design and cooling approach can maintain the Si IGBT junction temperature below 200 °C with 105 °C coolant. Finally, a buck converter composed of the phase-leg module is operated successfully with the device junction temperature heated up to 200 °C, which demonstrates the high temperature operation ability of the designed package module.
Keywords :
coolants; cooling; elemental semiconductors; finite element analysis; hybrid electric vehicles; insulated gate bipolar transistors; power bipolar transistors; silicon; FEA; IGBT phase-leg module packaging; Si; buck converter; coolant; cooling design; die selection; finite element analysis; hybrid electrical vehicle; layout design; material selection; temperature 105 C; temperature 200 C; three-phase motor drive; Coolants; Insulated gate bipolar transistors; Junctions; Multichip modules; Silicon; Temperature measurement; 200 °C Si devices based module; high temperature packaging and cooling design; hybrid electrical vehicle application;
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1215-9
Electronic_ISBN :
978-1-4577-1214-2
DOI :
10.1109/APEC.2012.6165864