Title :
Biological effect of nitrogen doped diamond-like carbon films for biomedical applications
Author :
Yang, P. ; Huang, N. ; Kowk, S.C.H. ; Leng, Y.X. ; Chen, J.Y. ; Wang, J. ; Leng, Y. ; Chu, P.K.
Author_Institution :
Dept. of Mater. Eng., Southwest Jiaotong Univ., Chengdu, China
Abstract :
Summary form only given. Carbon nitride films have received much attention recently because of their desirable properties, similar to diamond-link carbon (DLC) films. Thus we have compared the anti-thrombotic properties of amorphous carbon nitride films and DLC films as potential blood-contacting biomedical materials. In this work, the amorphous carbon nitride films and DLC films were deposited on silicon wafer substrates using a vacuum arc system. Surface thrombogenicity of the two films was evaluated by in vitrotests. An LDH assay was used to examine the platelets attached to the film surface. An F1+2 assay was used to evaluate the activation of clotting cascade. The fibrinogen adsorption and its conformational change were also investigated by using an immunoassay technique. The results show that the anti-thrombotic properties of the films were improved by nitrogen doping. This improvement is due to the inhibition of conformational change of adsorbed fibrinogen, preventing the adhesion of platelets and activation of clotting cascade.
Keywords :
adhesion; adsorption; amorphous state; biomedical materials; carbon compounds; diamond-like carbon; molecular biophysics; proteins; surface chemistry; thin films; vacuum deposition; C; CN; DLC films; Si; activation clotting cascade; adhesion platelet; amorphous carbon nitride films; antithrombotic properties; biological effect; biomedical applications; diamond-like carbon films; fibrinogen adsorption; film surface; immunoassay method; nitrogen doping; potential blood-contacting biomedical materials; silicon wafer substrates; surface thrombogenicity; vacuum arc system; vitrotests; Amorphous materials; Biomedical materials; Coagulation; Diamond-like carbon; Nitrogen; Semiconductor films; Silicon; Substrates; Vacuum arcs; Vacuum systems;
Conference_Titel :
Plasma Science, 2004. ICOPS 2004. IEEE Conference Record - Abstracts. The 31st IEEE International Conference on
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-8334-6
DOI :
10.1109/PLASMA.2004.1340079