• DocumentCode
    3509241
  • Title

    Application of the Spectral Analysis in Ultrasonic Quantitative Testing of Bonding Defect of Composite Material

  • Author

    Chang, Ning ; Zheng, Tao ; Ren, Yueqing

  • Author_Institution
    Fundament Dept., Chinese People´´s Armed Police Force Acad., Langfang
  • Volume
    3
  • fYear
    2009
  • fDate
    7-8 March 2009
  • Firstpage
    943
  • Lastpage
    945
  • Abstract
    The quantitative testing of bonding defect at interface of composite material is a problem in ultrasonic NDT filed. At present with the wide application of this material the demand for an effective method to increase testing accuracy and stability has become more and more evident. In this paper the ultrasonic echo signals are analyzed in frequency domain and extracted the coefficients of amplitudes attenuation as feature values by using the method of the spectral analysis. Quantitative testing and evaluation have been realized. The detail description of the principle and computing method of the maximum entropy spectral estimation and characteristic values extraction are presented in the paper. The detections to the practical samples were carried out and the results show the samples with different degree of debond flaws can be identified with high accuracy.
  • Keywords
    composite material interfaces; maximum entropy methods; spectral analysis; ultrasonic materials testing; amplitude attenuation coefficients; characteristic values extraction; composite material bonding defect; composite material interface; debond flaws; maximum entropy spectral estimation; spectral analysis; testing accuracy; testing stability; ultrasonic NDT; ultrasonic echo signals; ultrasonic quantitative testing; Amplitude estimation; Attenuation; Automatic testing; Bonding forces; Composite materials; Computer security; Entropy; Frequency domain analysis; Materials testing; Spectral analysis; amplitude attenuation coefficient; the maximum entropy spectral estimation; ultrasonic quantitative testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Education Technology and Computer Science, 2009. ETCS '09. First International Workshop on
  • Conference_Location
    Wuhan, Hubei
  • Print_ISBN
    978-1-4244-3581-4
  • Type

    conf

  • DOI
    10.1109/ETCS.2009.748
  • Filename
    4959463