• DocumentCode
    3509453
  • Title

    Rectifying characteristics of boron doped Si microneedle grown by in-situ doping VLS

  • Author

    Islam, Md Shofiqul ; Hasan, Kamrul

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
  • fYear
    2012
  • fDate
    18-19 May 2012
  • Firstpage
    790
  • Lastpage
    794
  • Abstract
    The electrical characteristics of boron doped silicon micro needle grown at low temperature by vapor-liquid-solid (VLS) mechanism is reported in this paper. Intrinsic silicon micro needle can be doped by conventional diffusion process at 1100°C after VLS growth but in this work in-situ doping is used which requires lower temperature at around 700°C. Boron doped p-type Si microneedles were grown by in situ doped VLS mechanism and the I-V characteristic was observed. It was found that the incorporation of doping reduces the resistivity of the needles and shows nonlinear I-V characteristic. Mathematical model of the I-V characteristic is proposed in this paper which is supported by the experimental values and simulation results. This model will be useful while using the needle as a sensor required for certain application.
  • Keywords
    Schottky barriers; boron; diffusion; electrical resistivity; elemental semiconductors; rectification; semiconductor doping; semiconductor growth; semiconductor-metal boundaries; silicon; I-V characteristic; Schottky barrier; Si:B-Au; boron doped silicon microneedle growth; conventional diffusion process; in-situ doping vapor-liquid-solid mechanism; mathematical model; rectifying characteristics; resistivity; sensor; temperature 1100 degC; Doping; Needles; Semiconductor process modeling; Schottky diode; Silicon microneedle; Vapor-liquid-solid; in-situ doping; intrinsic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Informatics, Electronics & Vision (ICIEV), 2012 International Conference on
  • Conference_Location
    Dhaka
  • Print_ISBN
    978-1-4673-1153-3
  • Type

    conf

  • DOI
    10.1109/ICIEV.2012.6317429
  • Filename
    6317429