DocumentCode :
3509556
Title :
Structural health monitoring of bridges using acoustic emission technology
Author :
Tan, Andy C C ; Kaphle, Manindra ; Thambiratnam, David
Author_Institution :
Fac. of Built Environ. & Eng., Queensland Univ. of Technol., Brisbane, QLD, Australia
fYear :
2009
fDate :
20-24 July 2009
Firstpage :
839
Lastpage :
843
Abstract :
Bridges are important part of society´s infrastructure and reliable methods are necessary to monitor them and ensure their safety and efficiency. Bridges deteriorate with age and early detection of damage helps in prolonging the lives and prevent catastrophic failures. Most bridges still in used today were built decades ago and are now subjected to changes in load patterns, which can cause localized distress and if not corrected can result in bridge failure. In the past, monitoring of structures was usually done by means of visual inspection and tapping of the structures using a small hammer. Recent advancements of sensors and information technologies have resulted in new ways of monitoring the performance of structures. This paper briefly describes the current technologies used in bridge structures condition monitoring with its prime focus in the application of acoustic emission (AE) technology in the monitoring of bridge structures and its challenges.
Keywords :
acoustic emission testing; bridges (structures); condition monitoring; failure analysis; flaw detection; inspection; sensors; structural engineering; acoustic emission technology; bridges; catastrophic failure; condition monitoring; damage detection; safety; sensors; society infrastructure; structural health monitoring; visual inspection; Acoustic emission; Acoustic testing; Bridges; Condition monitoring; Eddy current testing; Health and safety; Nondestructive testing; Optical fiber testing; Optical fibers; Shape; Acoustic emission; Bridge structures; Piezoceramics; Wavelet;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-4903-3
Electronic_ISBN :
978-1-4244-4905-7
Type :
conf
DOI :
10.1109/ICRMS.2009.5269952
Filename :
5269952
Link To Document :
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