High-pressure liquid cooling for high repetition-rate capacitors

Summary form only given. A limitation on the performance of a capacitor used in a high-energy high-repetition-rate application is the generation of heat within the capacitor. Heating affects dielectric properties and limits the overall lifetime of a capacitor. It is shown that direct liquid cooling can be integrated into a capacitor through one of the electrodes within the capacitor. The electrode was etched with microchannels and high pressure liquid circulated throughout the length of the electrode. Microchannel cooling has the potential of dissipating approximately 3 kW/cm/sup 2/ of the electrode surface area. Cooling of the dielectric within the capacitor is thus achieved, which increases the overall duty ratio for repetitive operation. Details of microchannel cooling, a thermal circuit for heat dissipation within a capacitor, and performance are discussed.