DocumentCode
3510198
Title
Calibrated measurements of elastic limit, modulus, and the residual stress of thin films using micromachined suspended structures
Author
Maseeh, F. ; Schmidt, M.A. ; Allen, M.G. ; Senturia, S.D.
Author_Institution
Microsyst. Technol. Lab., MIT, Cambridge, MA, USA
fYear
1988
fDate
6-9 June 1988
Firstpage
84
Lastpage
87
Abstract
Calibration of the suspended square membrane method using both finite-element methods (FEM) and comparison with conventional tensile tests is discussed. The use of suspended circular membranes to measure the elastic limit of thin films is reported. The techniques can be adapted to other thin films from which microfabricated specimens can be made. The Instron test results provided useful information about the material behavior, including Young´s modulus, whereas the membranes were used to determine quantitative values for residual stress and elastic modulus. The axisymmetric state of circular membranes under pressure were utilized effectively in determining the elastic limit of thin polymer films.<>
Keywords
calibration; elastic limit; elastic moduli measurement; finite element analysis; internal stresses; polymer films; stress measurement; tensile testing; thin films; Instron test; Young´s modulus; axisymmetric state; calibration; circular membranes; elastic limit; finite-element methods; micromachined suspended structures; modulus; polymer films; residual stress; suspended square membrane; tensile tests; thin films; Biomembranes; Finite element methods; Material properties; Polyimides; Polymer films; Residual stresses; Silicon; Stress measurement; Tensile stress; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
Conference_Location
Hilton Head Island, SC, USA
Type
conf
DOI
10.1109/SOLSEN.1988.26439
Filename
26439
Link To Document