Electronic packaging for microwave multichip modules

Author

Piloto, Andrew J.

Author_Institution

Kyocera America, San Diego, CA, USA

fYear

1999

fDate

1999

Firstpage

5

Abstract

Summary form only given. Modern radio frequency (RF) systems including radar/electronically scanned arrays are electronic systems in which MCMs are beginning to be applied. Conventional radars/RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz, a spread of over eight octaves. The development of monolithic microwave integrated circuit (MMIC) and application specific integrated circuit (ASIC) semiconductor technology has given rise to wider spread usage of analog and mixed mode (analog and digital) MCM designs within the major segments of the RF system. The challenge to MCM design is the incorporation of passive and active RF and DC components within a single MCM and the relationship between the materials, mechanical design and electrical performance of the MCM. As microwave semiconductor technology continues to evolve, so shall the demand on all aspects of analog and mixed mode MCMs

Keywords

MMIC; analogue integrated circuits; integrated circuit design; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; radar equipment; 220 MHz to 94 GHz; ASIC; MCM design; MCMs; MMIC; RF system; RF systems; active DC components; active RF components; analog MCM designs; analog MCMs; application specific integrated circuit; electrical performance; electronic packaging; electronic systems; materials; mechanical design; microwave multichip modules; microwave semiconductor technology; mixed mode MCMs; mixed mode analog/digital MCM designs; monolithic microwave integrated circuit; passive DC components; passive RF components; radar systems; radar/electronically scanned arrays; radiofrequency systems; Analog integrated circuits; Application specific integrated circuits; Electronics packaging; MMICs; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits; Multichip modules; Radar; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819181

Filename

819181