Study on Heat Transfer Performance of Micro Heat Pipe with Trapezium-grooved Wick

As the result of infinite yearning for product performance in microelectronics and chemicals, increasing integration level of microelectronic products has brought about the fatal problem of heat dissipation. In order to meet the challenge of high-power chips´ heat dissipation, micro heat pipe with trapezium-grooved wick was first described digitally in this paper, then mathematical models were set up for theoretical analysis, and finally some experiments were carried out on micro heat-pipes of different groove structures manufactured by high speed spinning. The results shows that, first, micro heat-pipe with trapezium-grooved wick has fairly good warm start performance; second, inclination angle has a big influence on its heat transfer performance; third, better heat transfer performances can be obtained when the ratio of the groove´s width to its wall thickness is 1:1 and the ratio of the groove´s depth to its width is 1.5:1; fourth, thermal conductivity of micro heat-pipes with trapezium-grooved wick can be 100 times that of red copper.