DocumentCode
3510324
Title
Implementation considerations for RAMBUSTM-based systems
Author
Evans, Robert J. ; Diepenbrock, Jay ; Sharrar, Robert
Author_Institution
Personal Syst. Group & Global Procurement, IBM Corp., Research Triangle Park, NC, USA
fYear
1999
fDate
1999
Firstpage
15
Lastpage
18
Abstract
Implementation of high bandwidth memory architectures presents many new design challenges. These include new memory socket designs, new process control and monitoring capabilities for PC board manufacturers, new tools and techniques for board designers, and investment in test equipment. This paper looks at a number of design challenges encountered in developing Direct RAMBUSTM based designs
Keywords
DRAM chips; SRAM chips; circuit CAD; integrated circuit packaging; memory architecture; printed circuit design; printed circuit manufacture; process control; process monitoring; software tools; system buses; Direct RAMBUS-based designs; PC board manufacture; RAMBUS-based systems; board design techniques; board design tools; high bandwidth memory architectures; implementation considerations; memory architectures; memory socket design; process control; process monitoring; test equipment; Bandwidth; Investments; Manufacturing processes; Memory architecture; Monitoring; Process control; Process design; Random access memory; Sockets; Test equipment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1999
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5597-0
Type
conf
DOI
10.1109/EPEP.1999.819184
Filename
819184
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