Title :
Edge erosion effects in double sided silicon micromachining
Author :
Zanini, M. ; Mikkor, M. ; Elder, R.C. ; Cathey, L.W. ; Bomback, J.L. ; Artz, B.E.
Author_Institution :
Ford Motor Co., Dearborn, MI, USA
Abstract :
The shape modifications observed on the edges of openings formed by a double-sided etch when etched past the breakthrough point are described. A method for predicting the overetching effects of such shapes is described. The implications that the results have on dimensional control of beams and orifices utilized in some micromachined silicon devices are also discussed. Orifices with relatively straight walls can be etched through
Keywords :
elemental semiconductors; etching; semiconductor technology; silicon; wear; Si; cantilevers; cross sections; dimensional control of beams; double-sided etch; edge erosion; internal edges; micromachining; orifices; overetching effects; passivation layer; shape modifications; Anisotropic magnetoresistance; Crystallography; Micromachining; Microstructure; Orifices; Rough surfaces; Shape control; Silicon; Surface roughness; Wet etching;
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
DOI :
10.1109/SOLSEN.1988.26451
