Title :
A miniature silicon accelerometer with built-in damping
Author_Institution :
IC Sensors, Milpitas, CA, USA
Abstract :
Silicon micromachining was utilized to produce a novel, miniature accelerometer comprising a three-layer silicon structure. The center layer contains the accelerometer proof mass supported by a double cantilever suspension. The outside two silicon caps provide protection, mechanical stops for the proof mass, and air damping of its major resonant frequencies. Critical damping is typically provided. Piezoresistors are used to sense the deflection of the silicon mass. By cross coupling the eight resistors in a Wheatstone bridge, substantial reduction in sensitivity to off-axis acceleration has been achieved. The integral packaging and air damping reduces production costs by simplifying the final assembly steps.<>
Keywords :
accelerometers; bridge instruments; electric sensing devices; elemental semiconductors; silicon; Si; Wheatstone bridge; air damping; built-in damping; cross coupling; double cantilever suspension; integral packaging; mechanical stops; micromachining; miniature accelerometer; off-axis acceleration; production costs; proof mass; protection; resonant frequencies; three-layer structure; Acceleration; Accelerometers; Bridge circuits; Damping; Micromachining; Piezoresistive devices; Protection; Resistors; Resonant frequency; Silicon;
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
DOI :
10.1109/SOLSEN.1988.26452