Title :
Half-conductive coupling for chip-to-chip connections
Author :
Pan, W. ; Tandt, C. De ; Devisch, F. ; Vounckx, R. ; Kuijk, M.
Author_Institution :
LAMI, Vrije Univ., Brussels, Belgium
Abstract :
A half-conductive layer forms a resistive network and is proposed to offer electrical interconnects between two mating substrates. Experimental results prove that sufficient conduction can be obtained for signal transmission at a reasonable crosstalk level
Keywords :
crosstalk; electrical conductivity; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; chip-to-chip connections; conduction; electrical interconnects; half-conductive coupling; half-conductive layer; mating substrates; resistive network; signal crosstalk level; signal transmission; Chip scale packaging; Conducting materials; Conductivity; Cost function; Electrodes; Flip chip; Lithography; Manufacturing industries; Network topology; Optical coupling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819187
