Title :
Parameter extraction for circuit models of electronic packages without optimization
Author :
Martens, Luc ; Sercu, Stefaan
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
Abstract :
In this paper, we derive circuit models for electronic packages starting from Z- or Y-matrix descriptions. If we propose a T- or a Π-circuit, a direct relation is found between the admittance and impedance values and the circuit parameters. No optimization is needed. The T- and Π-circuit models are valid for a general class of interconnections and packages. We illustrate the method on an example of a TAB interconnection structure
Keywords :
electric admittance; electric impedance; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; matrix algebra; network analysis; tape automated bonding; PI-circuit; T-circuit; TAB interconnection structure; Y-matrix description; Z-matrix description; admittance; circuit models; circuit parameters; electronic packages; impedance; interconnections; optimization; packages; parameter extraction; Admittance; Connectors; Electronics packaging; Frequency; Impedance; Information technology; Integrated circuit interconnections; Optimization methods; Parameter extraction; Pins;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819196
