DocumentCode :
3510623
Title :
Domain decomposition approach for capacitance computation of non-orthogonal interconnect structures
Author :
Veremey, Vladimir ; Mittra, Raj
Author_Institution :
Electromagn. Commun. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
fYear :
1999
fDate :
1999
Firstpage :
81
Lastpage :
84
Abstract :
In this paper, we apply the domain decomposition approach in conjunction with the finite difference (FD) method to compute, efficiently, the capacitance matrices of crossovers and via type interconnect structures formed by traces that are nonorthogonal in general. In the past, we have applied the FD method in conjunction with the perfectly matched layer (PML) and the impedance boundary condition for FD mesh truncation, to compute the capacitances of orthogonal interconnect configurations. In this work, we extend the above approach to apply to more general geometries, e.g. vias and crossovers with arbitrary angles. The paper presents some representative numerical results and examines the convergence and efficiency issues of the proposed algorithm
Keywords :
capacitance; circuit analysis computing; convergence of numerical methods; electric impedance; finite difference methods; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; FD mesh truncation; FD method; algorithm convergence; algorithm efficiency; capacitance computation; capacitance matrices; crossover type interconnect structures; crossovers; domain decomposition approach; finite difference method; impedance boundary condition; nonorthogonal interconnect structures; nonorthogonal traces; orthogonal interconnect configuration capacitances; perfectly matched layer; via type interconnect structures; vias; Boundary conditions; Capacitance; Convergence of numerical methods; Finite difference methods; Finite element methods; Geometry; Impedance; Matrix decomposition; Perfectly matched layers; Poisson equations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
Type :
conf
DOI :
10.1109/EPEP.1999.819198
Filename :
819198
Link To Document :
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