Title :
Modeling the effects of non-linear materials in de-coupling components of digital systems
Author :
Cokkinides, George ; Beker, Benjamin
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
Abstract :
This paper describes a physics-based numerical approach to building circuit models for electronic components that are made using nonlinear dielectrics. The resulting models are intended for use in time-domain circuit simulators to assess the effects of material nonlinearity on the electrical performance of such components as discrete, on-substrate and on-chip de-coupling capacitors. A 3D electrostatic field solver is modified to take into account the nonlinear field dependence of the dielectric material and is employed to calculate the Q-V curve for any capacitive structure. Subsequently, a time integration method (similar to that used in SPICE) is utilized to devise an appropriate time-stepping algorithm for the current-charge relationship of a nonlinear capacitor that can be used to simulate the time-domain electrical characteristics of such passive components. Sample results are also provided to illustrate the methodology
Keywords :
capacitors; circuit CAD; circuit simulation; dielectric thin films; digital integrated circuits; electromagnetic field theory; integrated circuit design; integrated circuit modelling; integration; permittivity; time-domain analysis; 3D electrostatic field solver; Q-V curve; SPICE; capacitive structure; circuit models; current-charge relationship; de-coupling components; dielectric material; digital systems; discrete de-coupling capacitors; electrical performance; electronic components; material nonlinearity effects; nonlinear capacitor; nonlinear dielectrics; nonlinear field dependence; nonlinear material effects; on-chip de-coupling capacitors; on-substrate de-coupling capacitors; passive components; physics-based numerical model; time integration method; time-domain circuit simulators; time-domain electrical characteristics; time-stepping algorithm; Capacitance; Capacitors; Circuit simulation; Computational modeling; Dielectric constant; Dielectric materials; Dielectric substrates; Digital systems; Time domain analysis; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819202