RF characterization of low cost MCM-D substrates, manufactured on large area panels

Author

Cottet, Didier ; Scheffler, Michael ; Grzyb, Janusz ; Oswald, Benedikt ; Tröster, Gerhard

Author_Institution

Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

1999

fDate

1999

Firstpage

115

Lastpage

119

Abstract

This article presents the RF characterization results of a large-area MCM-D technology developed within the EU LAP project. Microstrip lines were simulated, designed, and manufactured in several material combinations. Measurements up to 120 GHz showed good coincidence between simulation and reality. Future work is dedicated to filters and antennas in the 77 GHz range

Keywords

circuit simulation; integrated circuit design; integrated circuit measurement; integrated circuit packaging; microstrip lines; millimetre wave antennas; millimetre wave filters; millimetre wave integrated circuits; multichip modules; 120 GHz; 77 GHz; EU LAP project; RF characterization; antennas; filters; large area panels; large-area MCM-D technology; low cost MCM-D substrates; measurements; microstrip line design; microstrip line material combinations; microstrip line simulation; microstrip lines; simulation; Antenna measurements; Conducting materials; Costs; Dielectric materials; Dielectric substrates; Filters; Materials testing; Permittivity; Radio frequency; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819206

Filename

819206