Title :
RF characterization of low cost MCM-D substrates, manufactured on large area panels
Author :
Cottet, Didier ; Scheffler, Michael ; Grzyb, Janusz ; Oswald, Benedikt ; Tröster, Gerhard
Author_Institution :
Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
This article presents the RF characterization results of a large-area MCM-D technology developed within the EU LAP project. Microstrip lines were simulated, designed, and manufactured in several material combinations. Measurements up to 120 GHz showed good coincidence between simulation and reality. Future work is dedicated to filters and antennas in the 77 GHz range
Keywords :
circuit simulation; integrated circuit design; integrated circuit measurement; integrated circuit packaging; microstrip lines; millimetre wave antennas; millimetre wave filters; millimetre wave integrated circuits; multichip modules; 120 GHz; 77 GHz; EU LAP project; RF characterization; antennas; filters; large area panels; large-area MCM-D technology; low cost MCM-D substrates; measurements; microstrip line design; microstrip line material combinations; microstrip line simulation; microstrip lines; simulation; Antenna measurements; Conducting materials; Costs; Dielectric materials; Dielectric substrates; Filters; Materials testing; Permittivity; Radio frequency; Virtual manufacturing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819206
