DocumentCode
3510810
Title
High performance socket characterization technique for microprocessors
Author
Figueroa, David G. ; Chung, Chee Yee ; Cornelius, Michael D. ; Yew, Teong Guan ; Li, Yuan-Liang
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1999
fDate
1999
Firstpage
125
Lastpage
128
Abstract
At present, most socket suppliers provide different specifications and measurement data based on their own “in-house” characterization set-up, which has resulted in a variety of different data reported. To provide a means for designers to correctly decide on a socket or vendor, a standard specification and standard characterization method are necessary. This standard specification will also correctly represent the physical and electrical behavior of the socket. In this paper, a new socket specification is given. To more accurately estimate the socket parasitics, a new 3D modeling method is proposed. A new measurement technique is defined for precisely extracting a socket´s model component values. The measurement technique utilizes a de-embedding process and a unique test fixture to ensure the final parasitic values included only the parasitics of the socket. The difference between modeling and measured socket parasitics is within 10%. This technique has been demonstrated and adopted for all Intel socket suppliers
Keywords
electric connectors; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microprocessor chips; standards; 3D modeling method; Intel socket suppliers; de-embedding process; electrical behavior; in-house characterization; measurement technique; microprocessors; modeling; physical behavior; socket characterization technique; socket measurement data; socket model component value extraction; socket parasitics; socket specifications; socket supply; standard socket characterization method; standard socket specification; test fixture; Crosstalk; Fixtures; Impedance; Load flow; Load flow analysis; Measurement techniques; Microprocessors; Pins; Sockets; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1999
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5597-0
Type
conf
DOI
10.1109/EPEP.1999.819208
Filename
819208
Link To Document