An accurate and complete frequency dependent transmission line characterization using S-parameter measurements

Author

Winkel, T.-M.

Author_Institution

IBM Entwicklungs GmbH, Boblingen

fYear

1999

fDate

1999

Firstpage

133

Lastpage

136

Abstract

A very accurate and complete characterization of interconnects is presented. The method is based upon high-frequency S-parameter measurements of two lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. A comparison of results obtained from measurements on a silicon substrate and from calculations is given and shows excellent agreement

Keywords

S-parameters; electrical contacts; high-frequency transmission lines; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; probes; S-parameter measurements; Si; contact structures; frequency dependent transmission line characterization; high-frequency S-parameter measurements; interconnects; line length; measurement probes; silicon substrate measurements; Calibration; Frequency dependence; Frequency measurement; Impedance measurement; Length measurement; Propagation constant; Scattering parameters; Semiconductor device measurement; Transmission line measurements; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819210

Filename

819210