DocumentCode :
3510903
Title :
Power plane decoupling strategy for high speed processor boards
Author :
Roy, Tanmoy ; Smith, Larry
Author_Institution :
Sun Mirosys. Inc., Palo Alto, CA, USA
fYear :
1999
fDate :
1999
Firstpage :
141
Lastpage :
144
Abstract :
New generations of high speed processors are requiring more power. Consequently, in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper, an investigation has been conducted to find out the effects of decoupling capacitors on SI. A procedure for optimization of the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and was measured on a network analyzer. The authors have examined the effect of the decoupling strategy on SI
Keywords :
capacitors; circuit optimisation; driver circuits; electromagnetic compatibility; harmonics; high-speed integrated circuits; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; microprocessor chips; network analysers; power supply circuits; printed circuits; EMC; decoupling capacitors; dual processor board; fundamental frequency; harmonic frequencies; high speed processor boards; high speed processors; network analyzer; optimization; optimized decoupling strategy; power plane decoupling; power plane decoupling strategy; power planes; processor power requirements; signal integrity; switching currents; Capacitors; Degradation; Electromagnetic compatibility; Energy consumption; Frequency; Impedance; Noise level; Power engineering and energy; Resonance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
Type :
conf
DOI :
10.1109/EPEP.1999.819212
Filename :
819212
Link To Document :
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