DocumentCode
3510903
Title
Power plane decoupling strategy for high speed processor boards
Author
Roy, Tanmoy ; Smith, Larry
Author_Institution
Sun Mirosys. Inc., Palo Alto, CA, USA
fYear
1999
fDate
1999
Firstpage
141
Lastpage
144
Abstract
New generations of high speed processors are requiring more power. Consequently, in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper, an investigation has been conducted to find out the effects of decoupling capacitors on SI. A procedure for optimization of the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and was measured on a network analyzer. The authors have examined the effect of the decoupling strategy on SI
Keywords
capacitors; circuit optimisation; driver circuits; electromagnetic compatibility; harmonics; high-speed integrated circuits; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; microprocessor chips; network analysers; power supply circuits; printed circuits; EMC; decoupling capacitors; dual processor board; fundamental frequency; harmonic frequencies; high speed processor boards; high speed processors; network analyzer; optimization; optimized decoupling strategy; power plane decoupling; power plane decoupling strategy; power planes; processor power requirements; signal integrity; switching currents; Capacitors; Degradation; Electromagnetic compatibility; Energy consumption; Frequency; Impedance; Noise level; Power engineering and energy; Resonance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1999
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5597-0
Type
conf
DOI
10.1109/EPEP.1999.819212
Filename
819212
Link To Document