Title :
Computation of the frequency response of multiple planes in gigahertz packages and boards
Author :
Choi, Jiiiseong ; Swaminathan, Madhavan
Author_Institution :
Dept. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper discusses a simple and efficient method for computing the frequency response of a plane pair stack-up in multi-layered packages and boards. This method is suitable for high speed digital systems where the skin effect approximation is valid. The results have been compared to S-parameter measurements and show good correlation in the frequency range 50 MHz-1 GHz. The effects of decoupling capacitors on the frequency response have also been computed
Keywords :
S-parameters; capacitors; digital circuits; frequency response; packaging; printed circuits; skin effect; 50 MHz to 1 GHz; S-parameter measurements; decoupling capacitor effect; decoupling capacitors; frequency range; frequency response; high speed digital systems; multi-layered boards; multi-layered packages; multiple planes; packages; plane pair stack-up; skin effect approximation; Capacitors; Circuit noise; Current density; Frequency response; Impedance; Logic; Magnetic fields; Packaging; Skin effect; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819216
