Title :
Radiated emission from pin-fin heat sink mounted on an EBGA package
Author :
Qu, Pingyu ; Iyer, M.K. ; Qiu, Youlin
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
In this paper, radiated emissions from a commercial pin fin heat sink mounted on an EBGA package were studied. The effect of the pin length of the heat sink on the radiated field was analyzed. Finally, the mechanism of radiation enhancement was investigated, both from electromagnetic field and circuit points of view
Keywords :
ball grid arrays; circuit simulation; electromagnetic field theory; electromagnetic interference; heat sinks; integrated circuit modelling; integrated circuit packaging; thermal management (packaging); EBGA package; electromagnetic field; heat sink; pin length; pin-fin heat sink; radiated emission; radiated field; radiation enhancement mechanism; Asia; Computational modeling; Computer simulation; Electronics packaging; Finite difference methods; Heat sinks; Microelectronics; Power dissipation; Resistance heating; Substrates;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819225
