DocumentCode
3511221
Title
Study on the Continuous Quality Improvement Systems of LED Packaging Based on Data Mining
Author
He, Shu-Guang ; Li, Li ; Qi, Er-Shi
Author_Institution
Sch. of Manage., Tianjin Univ., Tianjin
fYear
2007
fDate
21-25 Sept. 2007
Firstpage
5625
Lastpage
5628
Abstract
LED is one of the most widely used components in electric products. And the LED packaging is a very important process between semiconductor manufacturers and the electric product manufacturers. Based on the analysis of the characteristics of the LED packaging processes, a quality control model based on SPC (statistical process control) and data mining is put forward. The data mining is used as the quality data analysis tool and the quality diagnosis method. Then an infrastructure of the integrated continuous quality improvement systems of the LED packaging is put forward. In this infrastructure, there are three layers of the data collection layer, the data analysis layer and the result viewer layer. Furthermore, the data warehouse of LED packaging is designed with the snowflake schema. A 3 layer yield rate SPC is studied and the decision tree method is used as a quality diagnosis method based on the designed data warehouse. Finally, a prototype of the continuous quality improvement system is developed.
Keywords
data mining; data warehouses; light emitting diodes; production engineering computing; quality control; semiconductor device packaging; statistical process control; LED packaging; continuous quality improvement system; data collection; data mining; data warehouse; electric product; quality control; quality data analysis; quality diagnosis; result viewer layer; snowflake schema; statistical process control; Data analysis; Data mining; Data warehouses; Decision trees; Light emitting diodes; Manufacturing processes; Process control; Quality control; Semiconductor device manufacture; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Communications, Networking and Mobile Computing, 2007. WiCom 2007. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1311-9
Type
conf
DOI
10.1109/WICOM.2007.1378
Filename
4341153
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