Title :
Design rule development for microwave flip chip applications
Author :
Staiculescu, Daniela ; Laskar, Joy ; Mather, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents a novel approach for analysis of factors to be considered when designing a flip chip package. It includes the design of an experiment and statistical analysis of the outputs. The most significant factors are found to be, from most to least important, the length of the area where the device and the substrate overlap (referred to as conductor overlap), the bump diameter and the width of the coplanar waveguide transmission line launch. These results are valid for conductor overlaps between 300 and 500 μm. For a lower overlap value (120 μm), the bump height also becomes significant. The substrate thickness in the 10 to 25 mil interval is found to be statistically insignificant, and therefore can be eliminated from further analysis
Keywords :
MMIC; coplanar waveguides; design of experiments; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; statistical analysis; 10 to 25 mil; 120 micron; 300 to 500 micron; bump diameter; conductor overlap length; coplanar waveguide transmission line launch width; design of experiment; design rule development; device-substrate overlap length; flip chip package design; microwave flip chip applications; output statistical analysis; Application software; Conductors; Coplanar waveguides; Design engineering; Flip chip; Input variables; Integrated circuit interconnections; Millimeter wave technology; Packaging; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819232
