DocumentCode :
3511418
Title :
Green laser annealing with light absorber
Author :
Shibahara, Kentaro ; Matsuno, Akira ; Takii, Eisuke ; Eto, Takanori
Author_Institution :
Res. Center for Nanodevices & Syst., Hiroshima Univ.
fYear :
2005
fDate :
4-7 Oct. 2005
Abstract :
To compensate deep penetration depth of green laser light into Si, metal absorber was formed on a specimen. TiN absorber was effective to reduce necessary laser energy density to activate dopant, however Mo worked oppositely. In addition, specimens with the absorber encountered the problem of over-melt that increased junction depth severely. Mechanisms of these results were discussed utilizing one-dimensional thermal diffusion analysis. Absence of reflectivity reduction was considered to be the key of this phenomenon
Keywords :
MOSFET; elemental semiconductors; laser beam annealing; melting; molybdenum; rapid thermal annealing; reflectivity; silicon; thermal conductivity; thermal diffusion; titanium compounds; MOSFET; Si-Mo; Si-TiN; dopant activation; green laser annealing; junction depth; laser energy density; light absorber; metal absorber; one-dimensional thermal diffusion analysis; over melting; penetration depth; rapid thermal annealing; Annealing; Laser transitions; Mass production; Optical pulses; Poles and towers; Power lasers; Silicon; Solid lasers; Thermal conductivity; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2005. RTP 2005. 13th IEEE International Conference on
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-9223-X
Type :
conf
DOI :
10.1109/RTP.2005.1613689
Filename :
1613689
Link To Document :
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