DocumentCode
3511724
Title
Low temperature copper de-oxidation
Author
Funk, K. ; v Zutphen, A. ; Granneman, Ernst H. A.
Author_Institution
ASM Eur., Almere
fYear
2005
fDate
4-7 Oct. 2005
Abstract
The impact of a post deposition annealing step of ECD copper and of a predeposition annealing step on the Cu seed has been investigated. Compared to forming gas it can be demonstrated that the addition of a small amount of ethanol can very effectively reduce the surface and grain boundary oxidation with benefits for the electrical parameters. The impact of a de-oxidation step down to 100degC on the Cu seed and its consequences for the ECD Cu growth are presented
Keywords
annealing; copper; grain boundaries; oxidation; Cu; ECD copper; electrical parameters; ethanol; forming gas; grain boundary oxidation; low temperature copper deoxidation; post deposition annealing step; predeposition annealing step; surface oxidation; Annealing; Copper; Ethanol; Europe; Grain boundaries; Oxidation; Temperature; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Thermal Processing of Semiconductors, 2005. RTP 2005. 13th IEEE International Conference on
Conference_Location
Santa Barbara, CA
Print_ISBN
0-7803-9223-X
Type
conf
DOI
10.1109/RTP.2005.1613703
Filename
1613703
Link To Document