Research progress on constitutive model of solder joints in micro-electronic packing

Author

Shao, Jiang ; Zeng, Chenhui ; Xu, Wenzheng ; Shan, Kunlun

Author_Institution

Aero Combined Environ. Lab., China Aero-Polytechnology Establ., Beijing, China

fYear

2009

fDate

20-24 July 2009

Firstpage

1248

Lastpage

1253

Abstract

The thermal-mechanical reliability of solder joints has been a key issue in the reliability assessment of electronic packaging. The recent developments in constitutive model of solder joints are summarized. Numerous constitutive models are proposed such as elastoplastic model, creep model, separated viscoplastic model, uniformed viscoplastic model and constitutive model based on fracture mechanics. At last, some suggestions for future investigations are also made.

Keywords

creep; elastoplasticity; fracture mechanics; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; solders; thermomechanical treatment; viscoplasticity; creep model; elastoplastic model; fracture mechanics; microelectronic packing; separated viscoplastic model; solder joint constitutive model; thermal-mechanical reliability; uniformed viscoplastic model; Capacitive sensors; Creep; Deformable models; Electronic mail; Electronics packaging; Predictive models; Soldering; Strain measurement; Stress; Temperature; Constitutive model; electronic packaging; solder joints; viscoplastic;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-4903-3

Electronic_ISBN

978-1-4244-4905-7

Type

conf

DOI

10.1109/ICRMS.2009.5270045

Filename

5270045