• DocumentCode
    3511825
  • Title

    Research on the reliability of SLD through accelerated life testing

  • Author

    Chao, Daihong ; Ma, Jing ; Li, Xiaoyang

  • Author_Institution
    Sch. of Instrum. Sci. & Opto-Electron. Eng., Beihang Univ., Beijing, China
  • fYear
    2009
  • fDate
    20-24 July 2009
  • Firstpage
    1263
  • Lastpage
    1267
  • Abstract
    As an important component, Super Luminescent Diode (SLD) is the most crucial factor that affects life and reliability of Interferotic Fiber Opitc Gyroscope(IFOG). Therefore, research on the reliability of SLD is the base of research on the reliability of IFOG. Research on the reliability of SLD was processed through accelerated life test (ALT). Based on related theoretic analysis, the sensitive stress was thus decided. By analyzing the failure mechanism and the configuration of SLD, an Arrhenius life-stress relationship was obtained, i.e. the accelerated model. Using Weibull distribution as its life distribution function, reliability assessment was achieved applying MLE data assessment method. And reliability assessment results of SLD at 25degC was gained. By analyzing the reliability assessment results, conclusion can be made that ALT on SLD is feasible.
  • Keywords
    fibre optic gyroscopes; life testing; semiconductor device reliability; superluminescent diodes; Arrhenius life-stress relationship; Weibull distribution; accelerated life testing; crucial factor; failure mechanism; interferotic fiber optic gyroscope; life distribution function; reliability assessment; sensitive stress; superluminescent diode; Acceleration; Distribution functions; Failure analysis; Gyroscopes; Life estimation; Life testing; Optical fiber testing; Stress; Superluminescent diodes; Weibull distribution; Weibull distribution; accelerated life test; reliability analysis; super luminescent diode;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-4903-3
  • Electronic_ISBN
    978-1-4244-4905-7
  • Type

    conf

  • DOI
    10.1109/ICRMS.2009.5270048
  • Filename
    5270048