DocumentCode :
3511909
Title :
Optimization in vacuum photothermal processing (VPP)
Author :
Axelevitch, A. ; Golan, G. ; Gorenstein, B.
Author_Institution :
Holon Acad. Inst. of Technol.
fYear :
2005
fDate :
4-7 Oct. 2005
Abstract :
Recent development in RTP enables the expansion of synergetic influence of electron flux and non-coherent light, mainly from UV and VUV spectrum, on treated samples. This expansion is called vacuum photothermal processing (VPP). The treatment consists of a simultaneous irradiation of samples with electron flux and non-coherent light produced by a heated tungsten coil in vacuum. This paper presents studies of the influence of VPP on the interface between silicon substrates and metal coatings deposited on top of it was found that VPP provides for stabilizing the deposited coatings, improves homogeneity and curing the irreversible electrical breakdown in thin-film systems; it also improves the roughness of interfaces between semiconductor and metal coatings. These modifications and improvements are explained by the appearance of an intermediate layer which is made up while VPP and passivates the interface. This built-in layer, produced during VPP treatment, was discovered and is shown in this study
Keywords :
coatings; electric breakdown; elemental semiconductors; interface roughness; photothermal effects; rapid thermal annealing; semiconductor-metal boundaries; silicon; surface treatment; ultraviolet radiation effects; UV spectrum; VUV spectrum; electron flux; irradiation effects; irreversible electrical breakdown; metal coatings; noncoherent light; semiconductor-metal interface; thin film system; tungsten coil; vacuum photothermal processing; Coatings; Coils; Curing; Electric breakdown; Electrons; Heat treatment; Semiconductor device breakdown; Silicon; Substrates; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2005. RTP 2005. 13th IEEE International Conference on
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-9223-X
Type :
conf
DOI :
10.1109/RTP.2005.1613713
Filename :
1613713
Link To Document :
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