Title :
Manufacturing research in the electronics industries
Author_Institution :
Hewlett-Packard Lab., Palo Alto, CA, USA
Abstract :
Summary form only given. The role of the Measurement and Manufacturing Center in the Hewlett-Packard Labs is described. The overall issues are: finer dimensions in components and interconnections; increased packing density; higher power; analog and digital requirements; frequencies ranging from DC to microwave and optical; quality; time to market; and cost. These topics are discussed with reference to programs on processes, materials, testing, simulation, and modeling at Hewlett-Packard Labs.<>
Keywords :
packaging; quality control; research and development management; Hewlett-Packard Labs; analogue requirements; components; digital requirements; electronics industries; interconnections; modeling; packing density; quality; simulation; testing; Consumer electronics; Electronics industry; Frequency; Industrial electronics; Manufacturing industries; Pulp and paper industry; Pulp manufacturing; Time to market;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16139
